GRENOBLE, FRANCE - Electronic System-Integration Technology (ESTC) Conference and Exhibition, the first event of the microelectronics and integration packages, took place from September 13-15, 2016, at the World Trade Center Grenoble, France. 

This international event was a great success, with over 400 academics and industry leaders have discussed and debated the state-of-the-art and future trends in packaging technologies and 'integration.

ESTC was the perfect opportunity to discover the latest news and developments in the field of electronic packaging and system integration.

The success of this conference proves that Grenoble is an internationally town in the microelectronics area.

To learn more about WTC Grenoble, please click on the source link below.